Selfbonding Wire Types

General

There is a big variety of self bonding wire types available. The different base coats and self bonding overcoats are described in different standards, such as IEC 60317, NEMA MW 1000 or JIS C3202, which sometimes still use different test methods.
Under the respective standard the typical technical values are given for the different base coats such as Polyurethane, Polyester, Polyesterimide etc. and for different bond coats such as Polyvinylbutyral, Polyamide etc.

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Europe

Selfbonding Copper Wire acc. to IEC

Product-Code
AB15
FS15
FSP18
FS18
PSP15
STP18
QTP18
RT21
Product-Name Butybond AB15 Solabond FS15 Solabond FSP18 Solabond FS18 Solabond PSP15 Thermobond STP18 Thermobond QTP18 Thermobond RT21
General Description
Base coat mod. Polyurethane mod. Polyurethane mod. Polyurethane Polyesterimide mod. Polyurethane mod. Polyurethane mod. Polyurethane A200 + Polyamidimide
Bond coat Polyvinylbutyral Polyamide Polyamide Polyamide Polyamide Polyamide Polyamide aromatic Polyamide
IEC (including the following standards) IEC 60317-35, 60317-2 IEC 60317-35, 60317-2 IEC 60317-36 IEC 60317-35, 60317-2 IEC 60317-35 IEC 60317-38
NEMA (including the following standards) MW 131-C MW 131 MW 131 MW 131 MW 131 MW 102
Diameters available 0.01 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm
Properties Low bonding temperature, wide process window, non-hygroscopic All bonding methods applicable, good processability, hygroscopic (not suited for humid regions) All bonding methods applicable, good processability, hygroscopic Solvent bonding possible, high resoftening temperature, high thermal and mechanical properties of base coat, hygroscopic thus not suitable for Asia All purpose selfbonding enamel, wide process window, high bonding strength, thermosetting applicable, non-hygroscopic Good winding ability, thermosetting applicable higher thermal and mechanical properties, very high resoftening temperature after thermosetting very high thermal and mechanical properties, very high resoftening temperature
Shelf life in months (at 25°C /
60% rel. humidity)		 ≤ 6 ≤ 3 (hygroscopic) ≤ 5 (hygroscopic) ≤ 5 (hygroscopic) ≤ 6 ≤ 6 ≤ 6 ≤ 6
Applications Stepping motors for quartz watches, instrument coils, voice coils, Sensors, Transponders Loudspeakers, small motors, sensors, Transponders Loudspeakers, small motors, sensors, Transponders Loudspeakers, small motors, sensors, Transponders Instrument coils, loudspeakers, vibration motors, sensors, receiver and speaker for mobile phones High power speaker, vibration motors high power speaker and receiver, micro speaker, high temperature applications motors, loudspeakers
Thermal values of base coat
Temperature index 20.000 h acc. to IEC 60172  158°C  158°C  192°C  195°C  158°C  192°C  192°C  212°C
Thermal stability chart [view]
Cut through temperature
0.05mm: acc. to IEC 60851-6 4 ≥ 200°C ≥ 200°C ≥ 230°C ≥ 265°C ≥ 200°C ≥ 230°C ≥ 230°C ≥ 320°C
Elektrisola typical value  225°C  225°C  260°C  315°C  225°C  260°C  260°C  365°C
0.25mm: acc. to IEC 60851-6 4 ≥ 200°C ≥ 200°C ≥ 230°C ≥ 265°C ≥ 200°C ≥ 230°C ≥ 230°C ≥ 320°C
Elektrisola typical value  230°C  230°C  265°C  325°C  230°C  265°C  265°C  380°C
Heat Shock
0.05mm: acc. to IEC 60851-6 3 ≥ 175°C ≥ 175°C ≥ 200°C ≥ 200°C ≥ 175°C ≥ 200°C ≥ 200°C ≥ 220°C
Elektrisola typical value  190°C  190°C  210°C  260°C  190°C  210°C  210°C  250°C
0.25mm: acc. to IEC 60851-6 3 ≥ 175°C ≥ 175°C ≥ 200°C ≥ 200°C ≥ 175°C ≥ 200°C ≥ 200°C ≥ 220°C
Elektrisola typical value  180°C  180°C  200°C  250°C  180°C  200°C  200°C  240°C
Electrical values
Low voltage continuity for Grade 1B wires
0.05mm: acc. to IEC 60851-5 1 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40
Elektrisola typical value  0  0  0  0  0  0  0  0
High voltage continuity for Grade 1B wires
0.05mm: Elektrisola typical value  0  0  0  0  0  0  0  0
0.25mm: acc. to IEC 60851-5 2 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10
0.25mm: Elektrisola typical value  0  0  0  0  0  0  0  0
Breakdown voltage acc. to IEC 60851-5 4 (at 20 °C, 35% humidity)
0.05mm: Elektrisola typical value 160 V/µm 160 V/µm 160 V/µm 160 V/µm 160 V/µm 160 V/µm 160 V/µm 160 V/µm
0.25mm: Elektrisola typical value 120 V/µm 120 V/µm 120 V/µm 120 V/µm 120 V/µm 120 V/µm 120 V/µm 120 V/µm
Calculation method of break voltage [view]
Pinholes acc. to IEC 60851-5 7
0.05mm: with 0% elongation good good very good very good very good very good
0.25mm: with 0% elongation good good very good very good very good very good
Mechanical values
Elongation for Grade 1B wire
0.05mm: acc. to IEC 60851-3 3.1 ≥ 14% ≥ 14% ≥ 14% ≥ 14% ≥ 14% ≥ 14% ≥ 14% ≥ 14%
Elektrisola typical value  23%  23%  23%  23%  23%  23%  23%  23%
0.25mm: acc. to IEC 60851-3 3.1 ≥ 25% ≥ 25% ≥ 25% ≥ 25% ≥ 25% ≥ 25% ≥ 25% ≥ 25%
Elektrisola typical value  40%  40%  40%  40%  40%  40%  40%  40%
Tensile strength for Grade 1B wires
0.05mm: Elektrisola typical value 57 cN 57 cN 57 cN 57 cN 57 cN 57 cN 57 cN 57 cN
0.25mm: Elektrisola typical value 1370 cN 1370 cN 1370 cN 1370 cN 1370 cN 1370 cN 1370 cN 1370 cN
Stress strain chart [view]
Bonding of wire
Hot air bonding 0.01 - 0.50 mm 0.01 - 0.50 mm 0.015 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.015 – 0.50 mm limited
Oven bonding 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 – 0.50 mm 0.10 – 0.50 mm
Resistance bonding 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 - 0.50 mm 0.10 – 0.50 mm 0.10 – 0.50 mm
Solvent bonding limited suitable suitable suitable not suitable not suitable not suitable not suitable
Recommended solvent Ethanol / Methanol Ethanol / Methanol Ethanol / Methanol Ethanol / Methanol N/A N/A N/A N/A
Recommended bonding temperature  120 - 140°C  150 - 170°C  150 - 170°C  150 - 170°C  150 - 170°C  180 - 200°C  200 – 220°C  200 – 220°C
Resoftening temperature for 0.25mm
(IEC 60851-3 7.1.2.4)		 ≥ 100°C ≥ 140°C ≥ 170°C ≥ 180°C ≥ 180°C ≥ 145°C ≥ 190°C ≥ 200°C
Bond strength chart
RoHS laboratory analysis view view view view view
Solderability
Solderability for Grade 1B wires
0.05mm: max. acc. to IEC 60851-4 5 2.0s / 390°C 2.0s / 390°C 2.0s / 390°C 3.0s / 470°C 2.0s / 390°C 3.0s / 390°C 3.0s / 390°C ---
Elektrisola typical value 0.8s / 390°C 0.4s / 390°C 0.7s / 390°C 1.3s / 470°C 0.4s / 390°C 0.4s / 420°C 1.0s / 390°C ---
Elektrisola typical value 1.5s / 370°C 0.5s / 370°C 1.0s / 370°C 0.7s / 370°C ---
0.25mm: max. acc. to IEC 60851-4 5 3.0s / 390°C 3.0s / 390°C 3.0s / 390°C 3.0s / 470°C 3.0s / 390°C 3.0s / 390°C 3.0s / 390°C ---
Elektrisola typical value 1.4s / 390°C 0.7s / 390°C 1.6s / 390°C 3.0s / 470°C 0.7s / 390°C 0.8s / 420°C 2.0s / 390°C ---
Elektrisola typical value 2.0s / 370°C 1.2s / 370°C 2.8s / 370°C 1.2s / 370°C
Solderability of different wire types chart [view]
Print
Asia (Standard)

Selfbonding Copper Wire acc. to IEC

Product-Code
BQP15
CSP15
ES22
ESP15
KSP15
KSP18
KS18
KS22
Product-Name Polyesterbond BQP15 Solabond CSP15 Solabond ES22 Solabond ESP15 Solabond KSP15 Solabond KSP18 Solabond KS18 Solabond KS22
General Description                
Base coat mod. Polyurethane mod. Polyurethane Polyamideimide mod. Polyurethane mod. Polyurethane mod. Polyurethane Polyesterimide Polyamideimide
Bond coat mod. Polyester Polyamide Polyamide Polyamide Polyamide Polyamide Polyamide Polyamide
IEC (including the following standards) IEC 60317-35, 60317-2 IEC 60317-35, 60317-2 --- IEC 60317-35, 60317-2 IEC 60317-35, 60317-2 IEC 60317-35 IEC 60317-36 ---
NEMA (including the following standards) MW 131 MW 131 --- MW 131 MW 131 --- --- ---
Diameters available 0.015 - 0.50 mm 0.015 - 0.50 mm 0.050 - 0.70 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.050 - 0.60 mm
Properties Easy bonding, wide process window Excellent solvent bonding, heat bonding possible Suitable for hot air bonding, very high thermal properties of base coat Suitable for hot air bonding, very good winding properties Suitable for hot air bonding, excellent solderability Suitable for hot air bonding, high thermal properties of base coat Suitable for hot air bonding, higher thermal properties of base coat Suitable for hot air bonding, very high thermal properties of base coat
Shelf life in months (at 25°C /
60% rel. humidity)		 ≤6 ≤6 ≤6 ≤6 ≤6 ≤6 ≤6 ≤6
Applications For sensors, instrument coils, RFID, transponders, card application For voice coils, small motor, vibration motors, transponders For molding inductor, small motor For sensors, instrument coils, voice coils, vibration motors For small motor, instrument coils, loudspeaker, sensors For small motor, instrument coils, loudspeaker, sensors, transponders For small motor, loudspeaker For small motor, inductor
Thermal values of base coat                
Temperature index 20.000 h acc. IEC 60172  164°C  164°C  230°C  164°C  164°C  192°C  195°C  230°C
Cut through temperature min. °C acc. to IEC 60851-6 4. ≥ 200°C ≥ 200°C ≥ 350°C ≥ 200°C ≥ 200°C ≥ 230°C ≥ 265°C ≥ 350°C
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  225 / 230°C  225 / 230°C  390 / 410°C  225 / 230°C  225 / 230°C  260 / 265°C  315 / 325°C  390 / 410°C
Heat shock min. °C acc. to IEC 60851-6 3. ≥ 175°C ≥ 175°C ≥ 240°C ≥ 175°C ≥ 175°C ≥ 200°C ≥ 200°C ≥ 240°C
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  190 / 180°C  190 / 180°C  250 / 240°C  190 / 180°C  190 / 180°C  210 / 200°C  260 / 250°C  250 / 240°C
Electrical values                
Low voltage continuity max. acc. to IEC 60851-5 5.2 for 0.05 mm ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40
ELEKTRISOLA-typical values for 0.05 mm, Grade 1B  0  0  0  0  0  0  0  0
High voltage continuity max. acc. to IEC 60851-5 5.3 for 0.25 mm ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10
ELEKTRISOLA-typical values for 0.25 mm, Grade 1B  0  0  0  0  0  0  0  0
Breakdown voltage acc. IEC 60851-5 4., (at 20°C, 35% humidity)                
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/µm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm
Mechanical values                
Elongation min. acc. to IEC 60851-3 3.1 for 0.05 mm/0.25 mm, Grade 1B ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25%
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%
Tensile strength                
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN
Bonding of wire                
Hot air bonding Suitable Suitable Suitable Suitable Suitable Suitable Suitable Suitable
Oven bonding Suitable Suitable Suitable Suitable Suitable Suitable Suitable Suitable
Resistance bonding Suitable Suitable Suitable Suitable Suitable Suitable Suitable Suitable
Solvent bonding Not suitable Suitable Not suitable Not suitable Not suitable Not suitable Not suitable Not suitable
Recommended solvent -- Ethanol / Isopropanol --- --- --- --- --- ---
Recommended bonding temperature  120 - 140°C  170 - 200°C  160 - 190°C  160 - 190°C  150 - 170°C  150 - 170°C  150 - 170°C  150 - 170°C
Resoftening temperature ≥ 90°C ≥ 140°C ≥ 130°C ≥ 130°C ≥ 105°C ≥ 105°C ≥ 105°C ≥ 105°C
Solderability                
Acc. to IEC 60851-4 5. max . seconds at °C for 0.05 mm/0.25 mm, Grade 1B 2.0s/390°C / 3.0s/390°C 2.0s/390°C / 3.0s/390°C Not Solderable 2.0s/390°C / 3.0s/390°C 2.0s/390°C / 3.0s/390°C 3.0s/390°C / 3.0s/390°C 3.0s/470°C / 3.0s/470°C Not Solderable
ELEKTRISOLA-typical values IEC 60851-4 5.                
for 0.05 mm, Grade 1B, 0.5s/370°C / 0.4s/390°C 1.0s/370°C / 0.6s/390°C --- 1.0s/370°C / 0.6s/390°C 0.5s/370°C / 0.4s/390°C 1.0s/370°C / 0.7s/390°C 1.9s/470°C ---
seconds at °C  
for 0.25 mm, Grade 1B, 1.2s/370°C / 0.7s/390°C 1.6s/370°C / 0.8s/390°C --- 1.6s/370°C / 0.8s/390°C 1.2s/370°C / 0.7s/390°C 2.8s/370°C / 1.6s/390°C 3.4s/470°C ---
seconds at °C    
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Asia (High Performance)

Selfbonding Copper Wire acc. to IEC

Product-Code
PSP15
PSP18
STP18
KTP18
KT22
LTP18
ETP18
ET22
Product-Name Solabond PSP15 Solabond PSP18 Thermobond STP18 Thermobond KTP18 Thermobond KT22 Thermobond LTP18 Thermobond ETP18 Thermobond ET22
General Description                
Base coat mod.Polyurethane mod.Polyurethane mod.Polyurethane mod.Polyurethane mod.Polyamidimide mod.Polyurethane mod.Polyurethane mod.Polyamidimide
Bond coat Polyamide Polyamide Polyamide Polyamide Polyamide Polyamide Polyamide Polyamide
IEC (including the following standards) IEC 60317-35, 60317-2 IEC 60317-35 IEC 60317-35 IEC 60317-35 --- IEC 60317-35 IEC 60317-35 ---
NEMA (including the following standards) MW 131 --- MW 131 --- --- --- --- ---
Diameters available 0.010 - 0.50 mm 0.010 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm
Properties high resoftening temperature after thermosetting, very good properties for hot-air bonding, very good winding properties, non-hyproscopic Thermosetting possible, high bonding strength, non-hygroscopic Higher thermal and mechanical properties, very high resoftening temperature after thermosetting, non-hygroscopic High resoftening temperature, suitable for High Current Test (HCT), high bonding strength, non-hygroscopic Very High resoftening temperature, suitable for High Current Test (HCT), high bonding strength, non-hygroscopic High resoftening temperature, suitable for High Current Test (HCT), high bonding strength, non-hygroscopic Excellent winding performance, high resoftening temperature, high bonding strength at the coil ends, suitable for High Current Test (HCT), non-hygroscopic Excellent winding performance, high resoftening temperature, high bonding strength at the coil ends, suitable for High Current Test (HCT), non-hygroscopic
Shelf life in months (at 25°C /
60% rel. humidity)		 ≤6 ≤6 ≤6 ≤6 ≤6 ≤6 ≤6 ≤6
Applications Instrument coils, loudspeakers, small motors, sensors, receiver and speaker for mobile phones Instrument coils, loudspeakers, motors, sensors High power speaker and receiver, micro speaker, high temperature applications High power speaker / receiver, Micro speaker High power speaker / receiver, Micro speaker Loudspeakers, Stepping motors, Voice coils, Sensors, Transponders High power speaker / receiver, Micro speaker High power speaker / receiver, Micro speaker
Thermal values of base coat                
Temperature index 20.000 h acc. IEC 60172  158°C  192°C  192°C  192°C  230°C  192°C  192°C  230°C
Cut through temperature min. °C acc. to IEC 60851-6 4. ≥ 200°C ≥ 230°C ≥ 230°C ≥ 230°C ≥ 350°C ≥ 230°C ≥ 230°C ≥ 350°C
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  225 / 230°C  260 / 265°C  260 / 265°C  260 / 265°C  390 / 410°C  260 / 265°C  260 / 265°C  390 / 410°C
Heat shock min. °C acc. to IEC 60851-6 3. ≥ 175°C ≥ 200°C ≥ 200°C ≥ 200°C ≥ 220°C ≥ 200°C ≥ 200°C ≥ 200°C
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  190 / 180°C  210 / 200°C  210 / 200°C  210 / 200°C  250 / 240°C  210 / 200°C  210 / 200°C  250 / 240°C
Electrical values                
Low voltage continuity max. acc. to IEC 60851-5 5.2 for 0.05 mm Grade 1 B ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40 ≤ 40
ELEKTRISOLA-typical values for 0.05 mm, Grade 1B  0  0  0  0  0  0  0  0
High voltage continuity max. acc. to IEC 60851-5 5.3 for 0.25 mm Grade 1B ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10 ≤ 10
ELEKTRISOLA-typical values for 0.25 mm, Grade 1B  0  0  0  0  0  0  0  0
Breakdown voltage acc. IEC 60851-5 4., (at 20°C, 35% humidity)                
ELEKTRISOLA-typical values test for 0.05 mm/0.25 mm, Grade 1B 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm 160 / 120 V/μm
Mechanical values                
Elongation min. acc. to 60851-3 3.1 for 0.05 mm/0.25 mm, Grade 1B ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25%
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%
Tensile strength                
ELEKTRISOLA-typical values for 0.05 mm/0.25 mm, Grade 1B 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN 57 / 1370 cN
Bonding of wire                
Hot air bonding 0.010-0.50mm 0.010-0.50mm 0.015-0.50mm 0.015-0.50mm 0.015-0.50mm Limited 0.015-0.50mm 0.015-0.50mm
Oven bonding 0.100-0.50mm 0.100-0.50mm 0.100-0.50mm 0.100-0.50mm 0.100-0.50mm Limited 0.100-0.50mm 0.100-0.50mm
Resistance bonding 0.100-0.50mm. 0.100-0.50mm 0.100-0.50mm 0.100-0.50mm 0.100-0.50mm Limited 0.100-0.50mm 0.100-0.50mm
Solvent bonding Not suitable Not suitable Not suitable Not suitable Not suitable 0.015-0.50mm Not suitable Not suitable
Recommended solvent --- --- --- --- --- Ethanol/Methanol --- ---
Recommended bonding temperature  150 - 170°C  150 - 170°C  180 - 200°C  220°C  220°C  220°C  220°C  220°C
Resoftening temperature (after postbaking) ≥ 125°C (180°C) ≥ 125°C (180°C) ≥ 145°C (190°C) ≥ 230°C ≥ 230°C ≥ 210°C ≥ 260°C ≥ 260°C
Solderability                
acc. to IEC 60851-4 5. max . seconds at °C for 0.05 mm/0.25 mm, Grade 1B 2.0s/390°C / 3.0s/390°C 3.0s/390°C / 3.0s/390°C 3.0s/390°C / 3.0s/390°C 3.0s/390°C / 3.0s/390°C Not solderable 3.0s/390°C / 3.0s/390°C 3.0s/390°C / 3.0s/390°C Not solderable
ELEKTRISOLA-typical values IEC 60851-4 5.                
for 0.05 mm, Grade 1B, 0.7s/370°C / 0.4s/390°C 1.2s/390°C 0.4s/420°C 0.5s/470°C --- n.a/420°C 0.6s/470°C ---
seconds at °C  
for 0.25 mm, Grade 1B, 1.2s/370°C / 0.7s/390°C 1.5s/390°C 0.8s/420°C --- --- n.a/420°C --- ---
seconds at °C  
Print
America

Selfbonding Copper Wire acc. to NEMA

Product-Code
ABN15
FS15
FSP18
FS18
AE21
AQ21
UT18
RT21
General Description
Base Coat / Base Coat Type mod. Polyurethane+Polyamide mod. Polyurethane mod. Polyurethane Polyesterimide A200 + Polyamidimide A200 + Polyamidimide Polyesterimide A200 + Polyamidimide
Bond Coat / Bond Coat Type Polyvinylbutyral Polyamide Polyamide Polyamide Epoxy Polyester Polyamide Aromatic Polyamide
NEMA (including the following standards) MW136 MW131 MW137 MW102 MW102
IEC (including the following standards) IEC 60317-35, 60317-2 IEC 60317-35, 60317-2 IEC 60317-35 IEC 60317-36 IEC 60317-38 IEC 60317-38 IEC 60317-36 IEC 60317-38
Diameter Available
AWG 24-58 AWG 24-58 AWG 24-58 AWG 24-54 AWG 24-58 AWG 24-54 AWG 24-54 AWG 24-58 AWG
mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.01 - 0.50 mm 0.015 - 0.50 mm 0.01 - 0.50 mm 0.015 - 0.50 mm 0.015 - 0.50 mm 0.01 - 0.50 mm
Properties Low Bonding Temperature Solvent Bonding Possible Solvent bonding possible, higher thermal properties. Solvent bonding possible, higher thermal properties. Low bonding temperature & Solvent bonding possible. High thermal and mechanical properties and high resoftening temperature. High thermal and mechanical properties, high resoftening temperature. Very high thermal and mechanical properties, very high resoftening temperature (non hygroscopic)
Shelf life in months (at 25°C /
60% rel. humidity)		 ≤ 6 ≤ 3 (hygroscopic) ≤ 5 (hygroscopic) ≤ 5 (hygroscopic) ≤ 6 ≤ 6 ≤ 6 (Hygroscopic) ≤ 6
Applications Stepper motors for watches, instrument coils, voice coils, sensors, transponders Instrument coils, loudspeakers, small motors, sensors Instrument coils, loudspeakers, small motors, sensors, transponders High power speaker and receiver, micro speaker, high temperature applications Instrument coils, loudspeakers, small motors, sensors, receiver and speaker for mobile phones High power speaker and receiver, micro speaker, high temperature applications High power speaker and receiver, micro speaker, high temperature applications Motors, loudspeakers 
Thermal Values of Base Coat
Temperature index 20.000 h acc. To IEC 60172  158°C  158°C  192°C  195°C  212°C  212°C  195°C  212°C
Cut-through Temperature 
Acc. to NEMA MW1000 3.5 for 44/30AWG: ≥ 200°C / ≥ 200°C ≥ 200°C / ≥ 200°C ≥ 230°C / ≥ 230°C ≥ 225°C ≥ 320°C ≥ 320°C ≥ 265°C ≥ 320°C
Elektrisola typical value for 44/30AWG:  225°C / 230°C  225°C / 230°C  260°C / 265°C  260°C / 265°C  365°C / 380°C  365°C / 380°C  260°C / 265°C  365°C / 380°C
Heat Shock 
Acc. To NEMA MW1000 3.5 for 44/30AWG: ≥ 175°C / ≥ 175°C ≥ 175°C / ≥ 175°C ≥ 200°C / ≥ 200°C ≥ 200°C ≥ 220°C ≥ 220°C ≥ 200°C ≥ 220°C
Elektrisola typical value for 44/30AWG:  190°C / 180°C  190°C / 180°C  210°C / 200°C  310°C / 320°C  250°C / 240°C  250°C / 240°C  310°C / 320°C  250°C / 240°C
Mechanical Values
Elongation for Type 1
Acc. to NEMA MW1000 3.4 for 44/30AWG: ≥ 10% / ≥ 22% ≥ 10% / ≥ 22% ≥ 10% / ≥ 22% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25% ≥ 14% / ≥ 25%
Elektrisola typical value for 44/30AWG:  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%  23% / 40%
Bonding of Wire
Hot Air Bonding 24-58 AWG 24-58 AWG 24-58 AWG 24-58 AWG 24-58 AWG 24-58 AWG 24-58 AWG 24-58 AWG
Oven Bonding 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG
Resistance Bonding 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG 38-24 AWG
Solvent Bonding Limited Suitable Suitable Suitable Suitable Suitable N/A N/A
Recommended Solvent Ethanol / Methanol Ethanol / Methanol Ethanol / Methanol Ethanol / Methanol Acetone/MEK Acetone/MEK
Recommended Bonding Temperature  120°C - 140°C  150°C - 170°C  150°C - 170°C  180°C - 220°C  120°C - 140°C  160°C - 190°C  180°C - 220°C  200°C - 220°C
Resoftening Temperature for 30AWG ≥ 100°C ≥ 140°C ≥ 170°C ≥ 180°C ≥ 100°C ≥ 180°C ≥ 180°C ≥ 200°C
Solderability
Solderability for Type 1
Acc. to NEMA MW1000 3.11 for 44/30AWG: 2.0s/390°C / 3.0s/390°C 2.0s/390°C / 3.0s/390°C 2.0s/390°C / 3.0s/390°C 2.0s/470°C / 3.0s/470°C - - -
Elektrisola typical value for 44 AWG: 0.8s/390°C / 1.3s/370°C 0.4s/390°C / 0.5s/370°C 0.7s/390°C / 1.0s/370°C 1.6s/470C - - -
Elektrisola typical value for 30 AWG: 1.4s/390°C / 2.8s/370°C 0.7s/390°C / 1.2s/370°C 2.0s/390°C / 2.8s/370°C 3.0s/470C - - 5.5s/470C -
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Elektrisola typical values are the result of various tests and represent average values.

We believe that all information in this catalogue is reliable and accurate, but the accuracy or completeness thereof is not guaranted.